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Isicelo Sokucaphuna

Ukuqedela ingaphezulu kuwuhlu olubanzi lwezinqubo zezimboni ezishintsha ubuso bento ekhiqiziwe ukuze kuzuzwe indawo ethile. [1] Izinqubo zokuqeda zingase zisetshenziselwe: ukuthuthukisa ukubukeka, ukunamathela noma ukumanzisa, ukudakwa, ukumelana nokugqwala, ukumelana nokubola, ukumelana namakhemikhali, ukumelana nokugqokwa, ukuqina, ukulungisa ukuguquguquka kukagesi, ukususa ama-burrs namanye amaphutha angaphezulu, nokulawula ukungqubuzana kwendawo. [2] Ezimweni ezilinganiselwe ezinye zalezi zindlela zingasetshenziswa ukubuyisela ubukhulu boqobo ukuze kuhlengwe noma kulungiswe into. Indawo engaqediwe ngokuvamile ibizwa ngokuthi isigayo.

Nazi ezinye zezindlela zethu ezijwayelekile zokwelapha ezingaphezulu:

I-anodizing: ukumboza insimbi ngesendlalelo se-oxide esivikelayo. Isiphetho singahlobisa, siqine, futhi simelane nokugqwala, futhi sinikeza indawo engcono yopende nokunamathela. I-Aluminium iyinsimbi evamile esetshenziselwa i-anodizing, kodwa i-titanium ne-magnesium nayo ingaphathwa ngale ndlela. Inqubo empeleni iyinqubo ye-electrolytic passivation esetshenziselwa ukwandisa ukushuba kongqimba lwe-oxide yemvelo ebusweni bensimbi. I-Anodizing itholakala ngenani lemibala.

I-Electroplatinginqubo yokunamathisela ungqimba oluncane lwenye insimbi noma ingxubevange ebusweni bensimbi ethile noma ezinye izingxenye zempahla kusetshenziswa i-electrolysis.

I-Physical Vapor Deposition(PVD) ibhekisela ekusetshenzisweni kobuchwepheshe bokukhipha i-arc ephansi, i-high-current arc ngaphansi kwezimo ze-vacuum, kusetshenziswa ukukhishwa kwegesi ukuhwamukisa okuhlosiwe kanye ne-ionize into ehwamukayo kanye negesi, kusetshenziswa ukusheshisa insimu kagesi ukwenza impahla ehwamukile. futhi umkhiqizo wayo wokusabela ufakwa kucwecwe lokusebenza.

I-Micro-Arc Oxidation, eyaziwa nangokuthi i-micro-plasma oxidation, iyinhlanganisela ye-electrolyte namapharamitha kagesi ahambisanayo. Ithembela ekushiseni okuphezulu ngokushesha kanye nengcindezi ephezulu ekhiqizwe ukukhishwa kwe-arc ebusweni be-aluminium, i-magnesium, i-titanium nama-alloys ayo. Isendlalelo sefilimu ye-Ceramic.

I-Powder Coatingukufafaza insipho yempushana phezu kwendawo yokusebenza ngomshini wokufafaza ngempushana (umshini wokufutha we-electrostatic). Ngaphansi kwesenzo sikagesi omile, impushana ikhangiswa ngokufanayo phezu kwendawo yokusebenza ukuze yakhe i-powder coating.

Okuluhlaza okwesibhakabhakaukugcwalisa isidumbu sonke nge-glaze yombala, bese kubhakwa esithandweni somlilo esishisayo esishisayo esingaba ngu-800 ° C. I-glaze yombala incibilika ibe uketshezi yisihlabathi esiqinile, futhi ngemva kokupholisa, iba umbala ogqamile. ilungiswe phezu kwesidumbu. I-Glaze, ngalesi sikhathi, i-glaze yombala iphansi kunokuphakama kocingo lwethusi, ngakho-ke kuyadingeka ukuphinda ugcwalise i-glaze yombala, bese i-sintered izikhathi ezine noma ezinhlanu, kuze kube yilapho iphethini igcwele usilika. umucu.

I-Electrophoresisi-electrophoretic coating ku-yin kanye ne-yang electrode. Ngaphansi kwesenzo se-voltage, ama-ion e-coating ion ahamba aye ku-cathode futhi ahlanganyele nezinto ze-alkaline ezikhiqizwe ebusweni be-cathode ukuze zakhe izinto ezingancibiliki, ezifakwa phezu kwendawo yokusebenza.

Ukupholisha ngomshinikuyindlela yokupholisha lapho indawo epholile isuswa ngokusikwa futhi ingaphezulu lezinto ezibonakalayo likhubazekile ngokwepulasitiki ukuze kutholwe indawo ebushelelezi.

I-Shot Blastingkuyinqubo ebandayo yokusebenza esebenzisa i-pellet ukuze ibhomule ngaphezulu kwendawo yokusebenza futhi ifake insalela yokucindezela kokucindezela ukuze kuthuthukiswe amandla okukhathala ocezu lokusebenza.

Ukuqhunyiswa kwesihlabathikuyinqubo yokuhlanza nokuqinisa ubuso be-substrate ngomthelela wokugeleza kwesihlabathi ngesivinini esikhulu, okungukuthi, ukusebenzisa umoya ocindezelwe njengamandla okwenza i-jet beam enesivinini esikhulu ukufafaza isifutho esinesivinini esikhulu (insimbi yethusi, i-quartz). isihlabathi, i-corundum, isihlabathi sensimbi, isihlabathi sase-Hainan) Ngaphezulu kwendawo yokusebenza okufanele iphathwe, ukubukeka noma ukuma kwengaphandle lendawo yokusebenza kuyashintsha.

Etchingkuyindlela lapho izinto zisuswa khona kusetshenziswa ukusabela kwamakhemikhali noma imithelela yomzimba. Ngokuvamile, i-etching ebizwa ngokuthi i-photochemical etching ibhekisela ekukhishweni kwefilimu evikelayo yesifunda ukuze igxishwe ngokwenza amapuleti e-exposure kanye nokuthuthukiswa, kanye nokuxhumana nesixazululo samakhemikhali ngesikhathi sokunamathisela ukuze kuzuzwe umphumela wokuhlakazeka nokugqwala, ngaleyo ndlela kwakheke. umphumela wokungalingani noma ukugoba.

In-Mold Decoration(IMD) okwaziwa nangokuthi ubuchwepheshe obungenapende, ubuchwepheshe bokuhlobisa indawo engaphezulu obudumile emhlabeni wonke, ifilimu esobala eqiniswe phezulu, isendlalelo sephethini yokuphrinta emaphakathi, isendlalelo somjovo ongemuva, imaphakathi neyinki, engenza umkhiqizo umelane nokungqubuzana. Ukuze uvimbele ukuthi ingaphezulu lingaklwebheki, nokugcina umbala ugqamile futhi kungabi lula ukufiphala isikhathi eside.

Out Mold Decoration(OMD) ukuhlanganiswa okubonakalayo, okuthintekayo, nokusebenzayo, ubuchwepheshe bokuhlobisa obunwetshiwe be-IMD, ubuchwepheshe bokuhlobisa ubuso be-3D obuhlanganisa ukuphrinta, ukuthungwa kanye ne-metalization.

Laser engravingokubizwa nangokuthi i-laser engraving noma ukumaka nge-laser, kuyinqubo yokwelashwa okungaphezulu kusetshenziswa izimiso zokubona. Sebenzisa i-laser beam ukuze udale uphawu oluhlala njalo ebusweni bento noma ngaphakathi kwempahla esobala.

Ukuphrinta Kwephediingenye yezindlela ezikhethekile zokuphrinta, okungukuthi, ukusebenzisa insimbi (noma ithusi, ipulasitiki ye-thermoplastic) gravure, kusetshenziswa ikhanda eligobile elenziwe ngezinto zenjoloba ye-silicone, uyinki epuleti le-intaglio uhlikihlwa phezu kwephedi, bese kuthi indawo engaphezulu yento oyifunayo ingaphrintwa ukuze iphrinte izinhlamvu, amaphethini, nokunye okunjalo.

Ukuphrinta Isikriniukwelula indwangu kasilika, indwangu yokwenziwa noma i-wire mesh kuhlaka, nokwenza ukuphrinta kwesikrini ngokudweba ngesandla noma ukwenza amapuleti e-photochemical. Ubuchwepheshe besimanje bokuphrinta isikrini busebenzisa okokusebenza okuzwela izithombe ukwenza ipuleti lokuphrinta lesikrini nge-photolithography (ukuze imbobo yesikrini yengxenye yesithombe esisepuleti lokuphrinta lesikrini ibe imbobo ephumela, kanye nembobo yemeshi yengxenye engeyona yesithombe ivinjwe. phila). Ngesikhathi sokuphrinta, uyinki udluliselwa ku-substrate nge-mesh yengxenye yesithombe ngokukhipha i-squeegee ukuze kwakhe umfanekiso ofanayo nowokuqala.

 

Ukudluliswa kwamanziwuhlobo lokunyathelisa lapho iphepha lokudlulisa/ifilimu yepulasitiki enephethini yombala ingaphansi kwe-macromolecular hydrolysis ngomfutho wamanzi. Le nqubo ihlanganisa ukukhiqizwa kwephepha lokunyathelisa lokudluliswa kwamanzi, ukucwiliswa kwephepha lezimbali, ukudluliswa kwephethini, ukomiswa, nemikhiqizo eqediwe.

I-Powder Coatingwuhlobo lokumboza olusetshenziswa njengempushana egelezayo, eyomile. Umehluko omkhulu phakathi kopende oluvamile lwe-liquid kanye ne-powder coating yukuthi i-powder coating ayidingi i-solvent ukuze igcine izingxenye ze-binder ne-filler ekugqokeni bese iphulukiswa ngaphansi kokushisa ukuze ivumele ukuthi igeleze futhi yakhe "isikhumba". Impushana ingaba i-thermoplastic noma i-thermoset polymer. Ngokuvamile isetshenziselwa ukwakha isiphetho esiqinile esiqinile kunopende ovamile. I-Powder coating isetshenziselwa ikakhulukazi ukumboza izinsimbi, njengempahla yasendlini, i-aluminium extrusions, i-hardware yesigubhu kanye nezingxenye zemoto nebhayisikili. Ubuchwepheshe obusha buvumela ezinye izinto, njenge-MDF (i-medium-density fibreboard), ukuthi igcotshwe ngempushana kusetshenziswa izindlela ezahlukene.

I-Chemical Vapor Deposition(i-CVD) iyindlela yokubeka esetshenziselwa ukukhiqiza ikhwalithi ephezulu, ukusebenza okuphezulu, izinto eziqinile, ngokuvamile ngaphansi kwe-vacuum. Inqubo ivame ukusetshenziswa embonini ye-semiconductor ukukhiqiza amafilimu amancane.

Electrophoretic Deposition(EPD): Isici esiphawulekayo sale nqubo ukuthi izinhlayiya ze-colloidal ezimiswe endaweni ewuketshezi zifuduka ngaphansi kwethonya lenkambu kagesi (i-electrophoresis) futhi zifakwe ku-electrode. Zonke izinhlayiya ze-colloidal ezingasetshenziswa ukwenza ukumiswa okuzinzile futhi ezingathwala imali zingasetshenziswa ekufakweni kwe-electrophoretic.

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