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Unyango loMphezulu

Ukugqitywa komphezulu luhlu olubanzi lweenkqubo zoshishino eziguqula umphezulu wento eyenziweyo ukufezekisa ipropati ethile. [1] Iinkqubo zokugqiba zingasetyenziselwa: ukuphucula inkangeleko, ukunamathela okanye ukumanzisa, ukuthengiswa, ukuxhathisa ukubola, ukuxhathisa ukubola, ukuxhathisa imichiza, ukuxhathisa, ukuqina, ukuguqula ukuhanjiswa kombane, ukususa i-burrs kunye nezinye iziphene zomhlaba, kunye nokulawula ukungqubuzana komhlaba. [2] Kwiimeko ezilinganiselweyo ezinye zezi ndlela zobuchule zingasetyenziselwa ukubuyisela imilinganiselo yokuqala ukusindisa okanye ukulungisa into. Umphezulu ongagqitywanga udla ngokubizwa ngokuba yingqusho.

Nazi ezinye zeendlela zethu eziqhelekileyo zonyango lomphezulu:

Anodizing: ukugqoka isinyithi kunye nomgangatho okhuselekileyo we-oxide. Ukugqitywa kunokuba yinto yokuhombisa, ehlala ixesha elide, kwaye inganyangeki kwi-corrosion, kwaye ibonelela ngomgangatho ongcono wepeyinti kunye nokunamathela. I-Aluminiyam yeyona ntsimbi ixhaphakileyo esetyenziselwa i-anodizing, kodwa i-titanium kunye ne-magnesium nayo inokunyangwa ngolu hlobo. Inkqubo eneneni yinkqubo ye-electrolytic passivation esetyenziselwa ukunyusa ubukhulu bomaleko we-oxide wendalo kumphezulu wesinyithi. I-Anodizing ifumaneka ngenani lemibala.

Electroplatingyinkqubo yokwandlala umaleko obhityileyo wenye isinyithi okanye ingxubevange kumphezulu wesinyithi okanye ezinye iindawo eziphathekayo kusetyenziswa i-electrolysis.

Ukubekwa koMphunga woMzimba(PVD) ibhekiselele ekusebenziseni i-low-voltage, i-high-current arc discharge technology phantsi kweemeko ze-vacuum, usebenzisa i-gas discharge ukuze ikhuphe i-jog kunye ne-ionize into ephuhliweyo kunye negesi, usebenzisa ukukhawulezisa intsimi yombane ukwenza izinto eziphuhliweyo. kwaye imveliso yayo yokusabela ifakwe kwi-workpiece.

IMicro-Arc Oxidation, eyaziwa ngokuba yi-micro-plasma oxidation, yindibaniselwano ye-electrolyte kunye neeparamitha zombane ezihambelanayo. Ixhomekeke kubushushu obuphezulu kwangoko kunye noxinzelelo oluphezulu oluveliswa kukukhutshwa kwe-arc kumphezulu we-aluminium, i-magnesium, i-titanium kunye ne-alloys yayo. Umaleko wefilimu yeCeramic.

Powder Coatingkukutshiza umgubo wokugquma phezu kwendawo yokusebenza ngesixhobo sokutshiza ngomgubo (umatshini wokutshiza we-electrostatic). Ngaphantsi kwesenzo sombane we-static, i-powder ibhengezwa ngokufanayo kumphezulu we-workpiece ukwenza i-coating powder.

Ukutshisa Bluekukugcwalisa isidumbu sonke nge-glaze yombala, emva koko kubhakwe kwisithando somlilo esineqondo lokushisa malunga ne-800 ° C. Umbala we-glaze unyibilika ube ngulwelo oluqinileyo olufana nesanti, kwaye emva kokupholisa, luba ngumbala oqaqambileyo. zilungiswe kwisidumbu. I-Glaze, ngeli xesha, umbala we-glaze ungaphantsi kunobude bocingo lobhedu, ngoko ke kuyimfuneko ukugcwalisa umbala we-glaze kwakhona, kwaye emva koko uhlanjululwe kane okanye amahlanu, de ipateni izaliswe ngesilika. umsonto.

Electrophoresisyi-electrophoretic coating kwi-yin kunye ne-yang electrode. Ngaphantsi kwesenzo se-voltage, ii-ion zokugquma ezihlawulisiweyo zihamba ziye kwi-cathode kwaye zidibanise nezinto zealkaline ezenziwe kumphezulu we-cathode ukwenza into engenakunyibilika, efakwe kumphezulu we-workpiece.

Ukugulisa oomatshiniyindlela yokupolisha apho indawo epholisiweyo isuswe ngokusikwa kwaye umphezulu wezinto eziphathekayo ukhubazeke ngokweplastiki ukuze ufumane indawo egudileyo.

Shot Blastingyinkqubo yokusebenza ebandayo esebenzisa ipellet ukubhobhoza umphezulu wesixhobo sokusebenza kunye nokufakela intsalela yoxinzelelo loxinzelelo ukunyusa amandla okudinwa kwesixhobo sokusebenza.

Ukuqhushumba kweSantiyinkqubo yokucoca kunye nokucoca umphezulu we-substrate ngempembelelo yokuhamba kwesanti yesantya esiphezulu, oko kukuthi, ukusebenzisa umoya ocinezelweyo njengamandla okwenza i-jet beam ye-high-speed yokutshiza i-speed spray (intsimbi yobhedu, i-quartz). isanti, isanti, i-corundum, isanti yentsimbi, isanti yaseHainan) Ukuya kumphezulu wesixhobo esiphathwayo, inkangeleko okanye ubume bomphandle womphezulu womsebenzi uyatshintsha.

Etchingbubuchule apho imathiriyeli isuswa kusetyenziswa iikhemikhali okanye iimpembelelo zomzimba. Ngokubanzi, i-etching ebizwa ngokuba yi-photochemical etching ibhekiselele ekususweni kwefilimu ekhuselayo yommandla ukuba ibhalwe ngokwenza ipleyiti yokuvezwa kunye nophuhliso, kunye nokunxibelelana nesisombululo sekhemikhali ngexesha lokudibanisa ukufezekisa isiphumo sokunyibilika kunye nomhlwa, ngokwenza oko. isiphumo sokungalingani okanye umngxuma.

In-Mold Decoration(IMD) ekwabizwa ngokuba yitekhnoloji engapeyinti, yitekhnoloji yokuhombisa ethandwa kumazwe ngamazwe, ifilimu ecacileyo ecacileyo, ephakathi yoshicilelo, umaleko wenaliti yangasemva, i-inki ephakathi, enokwenza imveliso imelane nokukhuhlana. Ukuthintela umphezulu ukuba ungakhatywa, kunye nokugcina umbala oqaqambileyo kwaye ungabi lula ukucima ixesha elide.

Out Mold Decoration(OMD) imbonakalo, i-tactile, kunye nokudibanisa okusebenzayo, i-IMD eyandisiweyo iteknoloji yokuhlobisa, iteknoloji yokuhlobisa indawo ye-3D edibanisa ukuprinta, ukuthungwa kunye ne-metallization.

Umkrolo weLaserekwabizwa ngokuba yi-laser engraving okanye i-laser marking, yinkqubo yonyango lomphezulu usebenzisa imigaqo ye-optical. Sebenzisa i-laser beam ukwenza uphawu olusisigxina kumphezulu wezinto eziphathekayo okanye ngaphakathi kwezinto ezibonakalayo.

Ushicilelo lwePadyenye yeendlela ezikhethekileyo zoshicilelo, oko kukuthi, ukusebenzisa intsimbi (okanye ubhedu, iplastiki ye-thermoplastic) igravure, isebenzisa intloko egobileyo eyenziwe ngezinto zerabha ye-silicone, i-inki kwipleyiti ye-intaglio ikhuhlwe kumphezulu wepad, emva koko umphezulu wento efunwayo inokuprintwa ukuprinta abalinganiswa, iipateni, kunye nokunye.

Ushicilelo lweSkrinikukwelula ilaphu lesilika, ilaphu elenziweyo okanye umnatha wocingo kwifreyimu, kunye nokwenza ushicilelo lwescreen ngokupeyinta ngesandla okanye ukwenza iipleyiti zefotochemical. Itekhnoloji yale mihla yoshicilelo lwesikrini isebenzisa imathiriyeli yefoto ukwenza ipleyiti yoshicilelo lwesikrini ngefotografi (ukuze umngxuma wesikrini wesahlulo segraphic kwipleyiti yoshicilelo lwesikrini ube ngumngxuma, kwaye umngxuma womnatha wenxalenye engeyiyo yomfanekiso uvaliwe. phila). Ngexesha lokushicilela, i-inki idluliselwa kwi-substrate ngokusebenzisa i-mesh yecandelo lomzobo ngokugqithiswa kwe-squeegee ukwenza umzobo ofanayo nowokuqala.

 

Ukuhanjiswa kwamanziluhlobo loshicilelo apho iphepha lokudlulisa / ifilimu yeplastiki enombala wombala iphantsi kwe-macromolecular hydrolysis ngoxinzelelo lwamanzi. Inkqubo ibandakanya ukuveliswa kwephepha lokuprinta lokuhanjiswa kwamanzi, ukufunxwa kwephepha leentyatyambo, ukuhanjiswa kwepateni, ukomiswa, kunye neemveliso ezigqityiweyo.

Powder Coatingluhlobo lokwaleka olusetyenziswa njengomgubo okhululekileyo, owomileyo. Umahluko omkhulu phakathi kwepeyinti yolwelo oluqhelekileyo kunye nomgubo wokugquma kukuba i-powder powder ayifuni i-solvent ukuze igcine i-binder kunye neendawo zokuzalisa kwi-coating kwaye zinyangwa phantsi kobushushu ukuze zivumele ukuba zihambe kwaye zenze "isikhumba". Umgubo unokuba yi-thermoplastic okanye i-thermoset polymer. Ngokuqhelekileyo isetyenziselwa ukudala ukugqitywa okunzima okunzima kunepeyinti eqhelekileyo. Ukugquma ngomgubo kusetyenziswa ikakhulu ukugquma kwesinyithi, njengezixhobo zasekhaya, ii-aluminium extrusions, izixhobo zemigqomo kunye neenxalenye zemoto kunye nebhayisekile. Ubuchwephesha obutsha buvumela ezinye izinto, ezifana ne-MDF (i-medium-density fibreboard), ukuba ibe ngumgubo ogqunywe ngeendlela ezahlukeneyo.

Ukubekwa kweMichiza yoMphunga(CVD) yindlela yokubeka esetyenziselwa ukuvelisa umgangatho ophezulu, ukusebenza okuphezulu, izinto eziqinileyo, ngokuqhelekileyo phantsi kwevacuum. Inkqubo isoloko isetyenziswa kwishishini le-semiconductor ukuvelisa iifilimu ezincinci.

I-Electrophoretic Deposition(EPD): Uphawu oluphawulekayo lwale nkqubo kukuba amasuntswana e-colloidal amisiwe kumanzi aphakathi afuduka phantsi kwefuthe lentsimi yombane (electrophoresis) kwaye afakwe kwi-electrode. Zonke iinqununu ze-colloidal ezingasetyenziselwa ukwenza ukumiswa okuzinzile kwaye ezinokuthwala intlawulo zingasetyenziswa kwi-electrophoretic deposition.

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